News

August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
May 24, 2023
DoD announces a $10M agreement with Six Sigma to boost microelectronics for military use. Learn more about this vital project.
Nickel Hydroxide Corrosion Residues
By No Author October 4, 2015
Identify nickel hydroxide corrosion residues on ceramic packages. Ensure reliability in military & space microelectronics. Contact us today!
March 9, 2007
SIX SIGMA's SolderQuik® tech enhances FPGA microcircuits on CFEsat. Learn more about our military & aerospace solutions.
Six Sigma’s Robotic Hot Solder Dip system
October 4, 2006
Address tin whisker risks in microelectronics with hot solder dip. Contact us for expert solutions in high-reliability applications.
Ceramic Column Grid Array (CCGA)
October 1, 2006
Review the Actel CCGA Board Level Testing Report. Ensure reliability for military & space applications. Contact us for details!

Recent Posts

August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset
May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics event poster with speaker photo, Earth backdrop, and May 5–7, 2026 details
April 27, 2026
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.