Mission Assurance Starts with the Right Interconnect

Your trusted partner for Column Attach, Ball Attach & Reballing, Hot Solder Dip, and Failure Analysis. Transforming commercial microelectronics into flight-ready hardware for the world's most critical missions.

Two microprocessors, one with pins exposed, reflecting on a dark surface.
Open metal chamber with a square, purple object on a mesh screen.
X-ray of a square microchip, showing internal connections and solder ball grid array.

Component Services

Six Sigma Microelectronics performs specialized microelectronic component modification services, such as Column Attach, Ball Attach & Reballing, and Hot Solder Dip.

Six Sigma’s column attach and hot solder dip manufacturing lines are

MIL-PRF-38535 QML-Q, V, & Y certified by the US Department of Defense.

Test Services

Test Services include: Solderability, Hermeticity, Ionic Cleanliness, Physical Dimensions, Column Pull, X-Ray Fluorescence (XRF), Ball Shear, and Lead Fatigue.

Six Sigma has been awarded Commercial Laboratory Suitability for MIL-STD-883 by the US Department of Defense.

Analytical Services

Analytical Services include: 3D X-ray, Acoustic Microscopy, and Metallographic Cross-sectioning.

Six Sigma performs analytical services in accordance with applicable government and industry standards.

News

Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset

Six Sigma Microelectronics at JEDEC JC-13 Working Group Meetings 2026

May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.
Six Sigma Microelectronics event poster with speaker photo, Earth backdrop, and May 5–7, 2026 details

Six Sigma Microelectronics to Present at SPWG 2026

April 27, 2026
Six Sigma Microelectronics will participate in the upcoming Space Parts Working Group Meeting, taking place May 5–7, 2026.
Advertisement for Six Sigma Microelectronics featuring a satellite orbiting Earth, service list, and booth information.

Six Sigma Microelectronics to Exhibit and Present at CMSE 2026

April 10, 2026
Join Six Sigma Microelectronics at CMSE 2026! Visit our booth and attend Minerva Cruz’s presentation on BGA Reballing for mission-critical applications.