Mission Assurance Starts with the Right Interconnect

Your trusted partner for Column Attach, Ball Attach & Reballing, Hot Solder Dip, and Failure Analysis. Transforming commercial microelectronics into flight-ready hardware for the world's most critical missions.

Two microprocessors, one with pins exposed, reflecting on a dark surface.
Open metal chamber with a square, purple object on a mesh screen.
X-ray of a square microchip, showing internal connections and solder ball grid array.

Component Services

Six Sigma Microelectronics performs specialized microelectronic component modification services, such as Column Attach, Ball Attach & Reballing, and Hot Solder Dip.

Six Sigma’s column attach and hot solder dip manufacturing lines are

MIL-PRF-38535 QML-Q, V, & Y certified by the US Department of Defense.

Test Services

Test Services include: Solderability, Hermeticity, Ionic Cleanliness, Physical Dimensions, Column Pull, X-Ray Fluorescence (XRF), Ball Shear, and Lead Fatigue.

Six Sigma has been awarded Commercial Laboratory Suitability for MIL-STD-883 by the US Department of Defense.

Analytical Services

Analytical Services include: 3D X-ray, Acoustic Microscopy, and Metallographic Cross-sectioning.

Six Sigma performs analytical services in accordance with applicable government and industry standards.

News

Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”

Six Sigma Microelectronics Achieves CMMC Level 2 Certification

August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!

Six Sigma Microelectronics Achieves ANSI/ESD S20.20-2021 Certification with Zero Nonconformances

August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset

Six Sigma Microelectronics at JEDEC JC-13 Working Group Meetings 2026

May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.