History

Winslow Automation incorporated

Designed and sold titanium solder pallets for PLCC packages

Patent awarded for ”Fixture for Wavesoldering Packaged Integrated Circuits”

Introduced the “Flexline” Robotic Solder Dip System

Opened Six Sigma division (Santa Clara, CA)

Purchased Mechanization Associates

Introduced Six Sigma component lead scanning and conditioning services

Purchased SolderQuik product line from Raychem

Moved to Concourse Drive (San Jose, CA)

Introduced Ball Attach and Reballing service

Introduced Column Attach service

Won SMT Magazine’s “Vision Rework and Repair Product of the Year Award” for BGA Preforms

Won Advanced Packaging Magazine’s Award for “Excellence in Interconnection” for Column Attach Services

Purchased and rebuilt current facility (Milpitas, CA)

Won City of Milpitas “Neighborhood Beautification Recognition Award”

Achieved Defense Supply Center Columbus (DSCC) Lab Suitability

Six Sigma’s 15th Anniversary

Cibola Flight Experiment Satellite launched with Six Sigma solder columns

Re-registered SolderQuik Trademark

Achieved AS9100C and ISO 9001:2008 Certification

Received Boeing award for exceptional supplier performance

Re-registered the “Flexline” trademark

SPWG technical presentation, “CGA Pad Solderability”

Winslow Automation, Inc. 25th Anniversary

SPWG technical presentation, “Nickel Hydroxide Corrosion Residues on HTCC Packages”

Obtained DLA QML Q, V, and Y certifications for Column Attach and Hot Solder Dip

Received NASA’s Supplier Outreach Award for being one of NASA’s most valuable suppliers

SMTA International technical presentation, “Nickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages”

Received Accreditation of Trust: DMEA Microelectronics Trusted Source

Acquired additional warehouse space

Expanded ESD-protected areas and improved facilities for COVID-19 preventive measures

Registered Trademark “Six Sigma Solder Columns”

Six Sigma shipped 200K CGA components to-date

Received a Defense Production Act (DPA) Title III contract to increase both column attach and solder column mfg capacity

Acquired 3D X-Ray Microscopy System

Six Sigma changed its name to Six Sigma Microelectronics