DoD Announces $10 Million Defense Production Act Title III Agreement With Six Sigma
As part of the nation’s effort to sustain the microelectronics manufacturing capability necessary for national and economic security, and in support of Executive Order 14017, America’s Supply Chains, the Department of Defense recently entered a $10 million agreement with Six Sigma utilizing Defense Production Act (DPA) Title III authorities.
Read MoreNickel Hydroxide Corrosion Residues on Metallized Ni/Au Ceramic Packages
This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture.
Read MoreSIX SIGMA Solder Column Technology used in CFEsat
SIX SIGMA is pleased to announce that it’s SolderQuik® column grid array technology has been used to ruggedize FPGA microcircuits on-board the Cibola Flight Experiment Satellite (CFEsat)
Read MoreHot Solder Dip and Minimizing Thermal Gradients
The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes. Read the PDF.
Read MoreActel CCGA Board Level Testing Report
Traditional Ceramic Quad Flat Pack (CQFP) or Ceramic Pin Grid Array (CPGA) packages are no longer suitable for today’s high I/O count FPGA devices. Higher pin-count packages such as Ceramic Column Grid Array (CCGA) become necessary for packaging today’s high-density FPGA devices. CCGA represents a key leveraging technology that offers high density packaging for high…
Read MoreBGA Reballing for Military & Aerospace Applications Poster
Poster with photos and process flow of the BGA reballing process for military and aerospace applications.
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