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Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”
August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!
August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
May 24, 2023
DoD announces a $10M agreement with Six Sigma to boost microelectronics for military use. Learn more about this vital project.
Nickel Hydroxide Corrosion Residues
By No Author • October 4, 2015
Identify nickel hydroxide corrosion residues on ceramic packages. Ensure reliability in military & space microelectronics. Contact us today!
March 9, 2007
SIX SIGMA's SolderQuik® tech enhances FPGA microcircuits on CFEsat. Learn more about our military & aerospace solutions.
Six Sigma’s Robotic Hot Solder Dip system
October 4, 2006
Address tin whisker risks in microelectronics with hot solder dip. Contact us for expert solutions in high-reliability applications.

Recent Posts

Blue cybersecurity chip graphic with lock icon, “CMMC Level 2 Certified” and “Strengthening Security for Mission-Critical Programs.”
August 28, 2026
Six Sigma Microelectronics achieves CMMC Level 2 Certification, enhancing cybersecurity for military microelectronics. Contact us today!
August 6, 2026
Six Sigma Microelectronics achieved ANSI/ESD S20.20-2021 certification with zero nonconformances. Learn more about our ESD control commitment.
Six Sigma micro ad for JEDEC JC-13 working group meetings, Memphis skyline at sunset
May 14, 2026
Members of the Six Sigma Microelectronics team will attend the JEDEC JC-13 Working Group Meetings in Memphis, Tennessee from May 18–21, 2026, to collaborate on industry standards for quality and reliability in specialized applications.