Technical Papers & Presentations
This study focuses on identifying the residues found on the surface of high temperature co-fired ceramic packages after prolonged exposure to moisture.
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The semiconductor industry’s move to pure-tin finishes is creating a dilemma for the high-reliability community. Most military and aerospace companies forbid the use of pure-tin because of the risk of tin whiskers. To resolve this dilemma, hot solder dip is being implemented to convert components to alternative finishes. Read the PDF.
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Poster with photos and process flow of the BGA reballing process for military and aerospace applications.
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