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Actel CCGA Board Level Testing Report
Traditional Ceramic Quad Flat Pack (CQFP) or Ceramic Pin Grid Array (CPGA) packages are no longer suitable for today’s high I/O count FPGA devices. Higher pin-count packages such as Ceramic Column Grid Array (CCGA) become necessary for packaging today’s high-density FPGA devices. CCGA represents a key leveraging technology that offers high density packaging for high…
Read MoreConverting Ball Grid Array to Column Grid Array Poster
Poster with photos and diagrams showing ball grid array components being converted to column grid array.
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