Actel CCGA Board Level Testing Report

Traditional Ceramic Quad Flat Pack (CQFP) or Ceramic Pin Grid Array (CPGA) packages are no longer suitable for today’s high I/O count FPGA devices. Higher pin-count packages such as Ceramic Column Grid Array (CCGA) become necessary for packaging today’s high-density FPGA devices. CCGA represents a key leveraging technology that offers high density packaging for high performance FPGA devices at a reliability level that can meet space satellite requirements.

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